More capacity
More compute in the same space. Higher power density enables greater rack density without increasing the volume.
High-Power Solutions
VOREVO develops high-density power conversion solutions for artificial intelligence (AI), high-performance computing (HPC), and next-generation data center infrastructure.
By combining semiconductor technology, advanced packaging, power module design, and industrial-scale manufacturing, we optimize every stage of development and the system as a whole.
From silicon to system.
01 The power challenge
AI workloads are redefining the requirements for power delivery. Rack power density is increasing. Core voltages are falling. Currents are rising, while load profiles are increasingly dynamic.
At the same time, available space remains limited, and thermal limits are becoming critical.
Delivering power is only part of the challenge. Managing heat is the other.
Power is no longer just infrastructure. It defines system performance.
02 The difference
More compute in the same space. Higher power density enables greater rack density without increasing the volume.
One integrated team from silicon to system. Co-design and short feedback loops reduce development time, getting you to a working, rack-ready solution faster.
Maximum uptime under demanding conditions. It is built and qualified for environments where failure is not an option.
Tell us about your requirements.
Together, we will define goals, milestones, and priorities.
03 The system approach
We treat power conversion as a complete system. Throughout the development process, VOREVO combines semiconductor technology, advanced packaging, power module design, system architecture, manufacturing, and qualification.
Together with our partners, we develop the power architectures from concept through co-design and evaluation to bring-up and rack integration.
Electrical, thermal, and mechanical aspects are considered together. Power delivery and thermal management are addressed as one engineering challenge.
04 The power architecture
AI racks are crossing the megawatt line. At these power levels, moving current at low voltage is no longer effective. Losses rise and copper and space requirements increase dramatically.
The industry's solution is higher voltage: 800 V HVDC enters the rack and is converted down in stages until it reaches the core.
This shifts the challenge from a single converter to a complete conversion chain: 800 V to the intermediate bus, the bus to the point of load, and the point of load to the core.
Each stage affects efficiency, density, and the thermal budget.
VOREVO engineers this entire chain as a single system. We cover all building blocks from the 800 V input to the core: semiconductors, advanced packaging, power modules, and system architecture.
Rather than combining modules developed independently, we engineer every building block to work together from the start.
05 The future of power architecture
To redefine what is possible in high-density power conversion and enable the next generation of compute, electrification and advanced industry.
We unite semiconductor innovation, power module engineering and industrial manufacturing to co-design efficient, reliable and scalable power architectures with our partners.
Start with your requirements. We turn them into a clear path to a rack-ready power solution.
